ERSA Juotostarkastus

Award winning and patented BGA inspection systems

For more than 15 years over 3,000 users worldwide have benefited the possibility to inspect hidden solder joints in a non destructive way. Whether for inspection under Flip Chips or for inspection where other microscopes are stretched to their limits: ERSASCOPE technology offers significant added value to any Quality Assurance program. Convince yourself of the many advantages of the ERSASCOPE inspection system!

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