ERSASCOPE 2 PLUS inspection system, complete

ERSASCOPE 2 - the complete solution for the inspection of BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints High end endoscope inspection system including three quick change heads:- 90° BGA head (approx. 280 µm clearance)- 90° Flip Chip head (approx. 30 µm clearance)- 0° wide angle head, e.g. for VIA inspection without tilting of optics 7 movement axes for flexible adjustment topractically every required viewing angle High-performance, dimmable LED lighting in daylight colour High quality 1.3 megapixel CCD colour camera with USB connection XY rotary table with fine adjust wheels, freely positionable under the optics Optimal light management:- inspection heads with fibre optic stereo front light- mechanically coupled, swivelling and rotating backlight- fibre optic gooseneck for targeted lighting from all sides- separate setting of light quantity for all light guides- with light brushes, light extension and iris aperture Focusing scale to be used with calibration groups in the ImageDoc EXP measuring function Complete set with the most important accessories and storage case