µ-dIFe 7 No-C LF Ball Dip 5cc

μ-dIFe 7 is a halide free, no-clean and lead-free dip paste. This solder paste has been de-signed for processes where the paste is applied by dipping, which is most suitable for components with ball grid arrays, gull wing and J-leads. In rework, as with the ERSA Dip&Print Station, applying a sol-der paste by dipping, will give a repeatable and selective paste vol-ume. This can result in a serious reduction of residues after solder-ing as well as of process time. The amount of paste that sticks to the component when dipping, in general, is less than when stencil printing. This can avoid typical fail-ures like bridging between the balls of (μ-)BGAs and CSPs. The maximum immersion depth in the dip paste is determined by the height of the component. The body of the component cannot make contact with the dip paste. μ-dIFe 7 is absolutely halide free, providing optimal reliability after soldering.